Machinery Park

MULTITEL

MULTITEL is specialized in laser sources development. We can provide a wide range of all-in-fibre laser sources adapted to the needs of our customers.
Our technology enables compact, reliable and cost effective solutions:
  • Large range of wavelengths (1µm, 1.55µm, 2µm)
  • CW laser sources up to 150 W average power
  • Nanosecond laser sources up to 150W average power
  • Femtosecond to picosecond pulsed laser sources up to 5W average power
  • Raman laser sources (spectral range covered from 1µm to 1.55µm)
  • Adjustable laser sources (pulse duration, repetition rate)
  • Narrow spectral linewidth
  • Excellent output beam quality
  • Wavelength conversion (SHG, THG)
  • Custom prototyping on demand
MULTITEL owns a versatile laser systems for material processing. The system is a re-configurable tool for laser micromachining based on a galvanometric head and on a 3D scanning system that can be used jointly or separately. The scanner permits to reach very high speeds (up to 4 m/s) with limited resolution down to 20 µm.The system can operate with various lasers, ranging from 400 fs up to the nanosecond regime. Multiple wavelengths are possible (UV, visible, NIR and MIR) depending on the material to be treated. We are strongly involved in laser-processing:
  • Cutting, drilling, marking
  • Surface modification (selective ablation, Lotus effect, Resonant Infrared Ablation)
MULTITEL owns means of characterization:
  • Optical profilometer
  • Optical microscope

SIRRIS

  • Stereolithography (SLA VIPER 3D system haute resolution, SLA 250 3D Systems)
  • Laser sintering of polymeric powder (EOSint P350 EOSint P390)
  • Paste polymerisation for ceramics and metals ( Optoform 1 : 40 Optoform 2)
  • Laser Cladding ( IREPA Laser DUOCLAD VI LF2000)
  • Laser Melting (SLM Solutions 250HL)

VITO

The Laser Centre Flanders currently consists of 5 full time researchers and 2 qualified research assistants. Research in the field of laser materials processing is performed since about 15 years. Concerning the available laser sources and manipulation systems, VITO is very well equipped with about 12 commercial laser sources (diode, CO2, Nd-YAG and fiber) with various power ranges and beam characteristics. Apart from the laser sources, VITO has also some peripheral equipment for beam analysis, process monitoring and control and camera systems. The laser group is also supported by a material analysis and testing group. Research project are performed in the field of materials characterization involving metallographic, mechanical and tribological analysis on a national and international level for supporting the activities at the Materials Department but also for external companies, universities and research institutes.
The Materials Technology Department has following characterization equipments:
  • Mechanical testing (tensile, compression, 3- and 4-point bending, hardness measurement)
  • Tribological testing (universal tribometers at room and elevated temperature, pin-on-disc, micro-abrasion test)
  • Nano-indentation
  • Thermogravimetric analysis (TGA), differential scanning calorimetry (DSC)
  • Optical microscopy, image analysis
  • Field emission scanning electron microscopy (FESEM), transmission electron microscopy (TEM)
  • X-ray photo-electron spectroscopy (XPS), X-ray diffraction (XRD)
  • Particle size distribution analysis, specific surface area measurement
  • Profilometry (contact and white light)

KARLSRUHE INSTITUTE OF TECHNOLOGY

  • Laser workstations: 4 excimer laser micromachining systems, 3 Nd:YAG lasers, 2 Ytterbium fiber lasers, 3 CO2 lasers, high power diode laser, ultrafast fiber laser (300fs-10ps, UV, VIS, NIR)
  • Laser-assisted functionalisation of thick and thin films (deposition techniques: rf magnetron sputtering, tape casting)
  • Characterisation methods for laser treated materials: Raman, XRD, battery cycler, SEM, EDX, Laser Ablation ICP-MS, ICP-OES, Auger Electron Spectroscopy, thermo-physical analytics (battery calorimeter, DSC, laser flash technique, photo-acoustic methods), materialography, white light and laser profilometry, contact angle measurements
  • Furthermore, different types of high resolution analytic methods such as TEM, TOF-SIMS, XPS and FIB are available within KIT and KNMF user facility

BAYERISCHES LASERZENTRUM

Our motivated team of highly qualified engineers and natural scientists of various areas of expertise is the indispensable base of the blz. In order to answer photonic questions comprehensively, the blz offers a wide range of laser equipment of various capacities and, therefore, covers the entire range of technically interesting wavelengths:
  • Solid state lasers, including disc and fibre lasers, of various wavelengths and power ranges for diverse processing, e.g. macro and micro joining, structuring
  • CO2 lasers of various power ranges for welding and cutting
  • Excimer lasers with different wavelengths for precision work
  • Ultra short pulse lasers for “cold” material processing in the micro- and nano-scale
  • Selective laser melting, laser sintering and stereolithography equipment for fast and flexible additive manufacturing of polymers and metals
  • Access to further lasers and analysis systems in cooperation with the University of Erlangen-Nürnberg
  • Particularly in the field of process-analysis and laser beam characterization, the blz holds a large pool of measuring instruments

IREPA LASER

IREPA LASER is equipped with a large range of laser machines.
More than 20 lasers: CO2, Nd-YAG, Excimer, fibre, diode, disk, from 10W to 6kW.
New micromachining experimental centre equipped with short and ultra-short pulsed laser for micro applications like drilling, cutting, thin layer ablation texturing, engraving and glass welding…


Associated equipment:
  • Linear stages 3 to 5 axes for the treatment of large surfaces (400mm x 400 mm)
  • Anthropomorphic robot
  • 2D and 3D scanner (beam size 1µm ≤ Ø ≤ 100µm)
  • Mask pattern projection
Characterization means:
  • Optical microscope
  • Microhardness tester
  • Profilometer

THE UNIVERSITY OF BIRMINGHAM

  • Laser micromachining system that integrated two laser sources, in particular femto-/pico- second laser source, and MOPA-based Yb fibre laser for scanning micro-processing and surface structuring (the systems will be delivered by the end of 2012)
  • Laser drilling system, in particular DMG Lasertec 80 PowerDrill, based at the MTC
  • Laser additive manufacturing systems, in particular 3D Systems Sinterstation Pro, 3 Axis Direct laser fabrication system fitted with 1.7kW CO2 laser, 6.5 Axis Direct laser fabrication (blown powder) system with 4kW disc laser (Trumpf) and Concept Laser Cusing M2 powder bed machine

THE UNIVERSITY OF CARDIFF

  • DMG40SI - microsecond laser system
  • DMG40 Sauer - nanosecond laser system
  • Picolase1000 - picosecond laser system
  • 4X SLS machines (CO2 laser systems)
  • 2X SLA systems (UV lasers)
  • Laser scanning head (reverse engineering)